Wire bond package and packaging method
US6858474B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 1, 2003 |
| Grant date | Feb 22, 2005 |
| Priority date | — |
| Expiry date | Dec 1, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for packaging a plurality of dies is disclosed. Each die is attached to a corresponding mounting station in a structural member that includes a base member having first and second surfaces and a plurality of mounting stations. Each mounting station has a cavity wall that surrounds that mounting station and extends from the first surface thereby forming an open cavity around the mounting station. After the dies have mounted, a lid sheet is positioned over the structural member. The lid sheet includes a plurality of covers for closing the cavities. The covers are connected to one another by connection members. The structural member with the positioned lid sheet is then placed in a mold with a molding compound in contact with the lid sheet. The mold has a surface that forces the covers against the cavity while forcing the molding compound between the cavity walls.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.