Beng Huat Low
3Patents
2h-index
6Co-inventors
30Inventor score
Filing activity: Feb 20, 2003 → Sep 15, 2006
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7800581B2 | User input device with self-centering flat spring | Physics | 13 | Active |
| US6858474B1 | Wire bond package and packaging method | Electricity | 3 | Expired |
| US7114939B2 | Encapsulating brittle substrates using transfer molding | Performing Operations; Transporting | 1 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.