Composite sacrificial material
US6858528B2 · kind B2 · utility
9Cited by
11References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 20, 2003 |
| Grant date | Feb 22, 2005 |
| Priority date | — |
| Expiry date | Apr 15, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76808
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A composite sacrificial material is deposited in a void or opening in a dielectric layer on a semiconductor substrate. The composite sacrificial material includes a polymeric or oligomeric matrix with filler material mixed therein. The filler material may be particulate matter that may be used to modify one or more properties of the composite sacrificial material during semiconductor processing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.