Electronic component with a semiconductor chip and method of producing the electronic component

US6858799B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Harry Hedler · Germering, DE
• Bernd Römer · Burgau, DE

Key dates

• Filing date: Jan 24, 2002
• Grant date: Feb 22, 2005
• Expiry date: Jan 24, 2022

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/14
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An electronic component includes a semiconductor chip that has an active upper side with integrated circuits and a passive rear side. The rear side and the side border regions of the semiconductor chip also form the outer package sides of the electronic component. At least the corner regions and the edge regions of the rear side and the side border regions of the semiconductor chip have a plastic coating with a thickness in the micrometer range. Furthermore, the invention relates to a method of producing such an electronic component.