Ferroelectric memory integrated circuit with improved reliability
US6858890B2 · kind B2 · utility
4Cited by
7References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 4, 2002 |
| Grant date | Feb 22, 2005 |
| Priority date | — |
| Expiry date | Aug 24, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10B53/30
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An IC with memory cells arranged in a chained architecture is disclosed. The top local interconnect between the top capacitor electrodes and active area is achieved by using a strap. The use of a strap eliminates the need for additional metal layer which reduces manufacturing costs. Furthermore, sidewall spacers are used to isolate the strap from the different layers of the capacitors. The use of spacers advantageously enables the strap to be self-aligned.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.