Microelectronic fabrication system components and method for processing a wafer using such components
US6860944B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 16, 2003 |
| Grant date | Mar 1, 2005 |
| Priority date | — |
| Expiry date | Jun 16, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76874
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A process chamber is provided which includes a gate configured to align barriers with an opening of the gate and an opening of the process chamber such that the two openings are either sealed or provide an air passage to the chamber. A method is provided and includes sealing an opening of a chamber with a gate latch and exposing a topography to a first set of process steps, opening the gate latch such that an air passage is provided to the process chamber, and exposing the topography to a second set of process steps without allowing liquids within the chamber to flow through the air passage. A substrate holder comprising a clamping jaw with a lever and a support member coupled to the lever is also contemplated herein. A process chamber with a reservoir arranged above a substrate holder is also provided herein.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.