Method and system for forming a semiconductor device
US6861365B2 · kind B2 · utility
22Cited by
4References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2002 |
| Grant date | Mar 1, 2005 |
| Priority date | — |
| Expiry date | Apr 16, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3085
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and system for forming a semiconductor device is provided. The method and system involves the utilization of a stamping tool to generate three-dimensional resist structures whereby thin film patterning steps can be transferred to the resist in a single molding step and subsequently revealed in later processing steps. Accordingly, the alignments between successive patterning steps can be determined by the accuracy with which the stamping tool has been fabricated, regardless of the dilations or contractions that can take place during the fabrication process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.