Silicon-based high speed optical wiring board
US6862378B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 24, 2002 |
| Grant date | Mar 1, 2005 |
| Priority date | — |
| Expiry date | Apr 24, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4201
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An optical wire board which utilizes a silicon substrate as the base for both the optical subassembly and the electrical RF transmitting circuit. An optical fiber is preferably passively aligned to the active optical device mounted on the optical subassembly using a V-groove etched into the silicon (and may include a lens or other optical element positioned between the fiber and the active device). An integrated circuit for coupling the active optical device to external contacts is preferably flip-chip mounted to the silicon substrate upon pads disposed on precisely defined edges around a cavity etched beneath the circuit, the inclusion of the cavity beneath the electrical circuit functioning to minimize the dielectric loading effect of the silicon substrate on the integrated circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.