Low temperature methods of bonding components
US6863209B2 · kind B2 · utility
16Cited by
21References
55Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 14, 2001 |
| Grant date | Mar 8, 2005 |
| Priority date | — |
| Expiry date | Feb 11, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/3692
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Methods of bonding two components may include positioning the components relative to one another to obtain a desired orientation. Once the desired orientation is obtained, the components can be bonded in the desired orientation with metal wherein a temperature of both components is maintained below a melting temperature of the metal while bonding. Related structures are also discussed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.