Microstructured thermosensor

US6863438B2 · kind B2 · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Thorsten Pannek · Stuttgart, DE
• Hans-Peter Trah · Reutlingen, DE

Key dates

• Filing date: Jun 7, 2001
• Grant date: Mar 8, 2005
• Expiry date: Jun 7, 2021

Classification

• Technology area (CPC G): Physics
• CPC primary: G01J5/12
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A micropatterned thermosensor, e.g., an infrared sensor, includes a supporting body and at least one thermocouple arranged thereon. The thermocouple also has a first material and a second material, which together form, at least in a pointwise manner, at least one thermal contact. Furthermore, it is provided that the first and/or the second material are configured at least regionally in the form of a meander-shaped or undulating-type circuit trace and extend on the supporting body. In addition, a micropatterned thermosensor having such patterned circuit traces, in which the first material is platinum or aluminum, and the second material is doped or undoped polysilicon-germanium.