Method for reducing cu surface defects following cu ECP
US6863796B2 · kind B2 · utility
6Cited by
1References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 2, 2002 |
| Grant date | Mar 8, 2005 |
| Priority date | — |
| Expiry date | Apr 20, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for cleaning an electrodeposition surface following an electroplating process including providing a process surface including electro-chemically deposited metal following an electrodeposition process; and, cleaning the process surface with a sulfuric acidic cleaning solution to remove electrodeposited metal particles according to at least one of an immersion and spraying process the spraying process including simultaneously rotating the process surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.