Semiconductor device having a carbon fiber reinforced resin as a heat radiation plate having a concave portion
US6864120B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 12, 2004 |
| Grant date | Mar 8, 2005 |
| Priority date | — |
| Expiry date | Feb 12, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device comprises a substantially flat interconnection substrate having an interconnection pattern formed on a surface thereof. A semiconductor element is mounted on the substantially flat interconnection substrate so that an electrode terminal of the semiconductor element is electrically connected to the interconnection pattern. A heat radiation plate is formed in a form of a sheet having a concave portion so as to cover the semiconductor element and is bonded on the surface of the substantially flat interconnection substrate. An external connection terminal is formed on the other surface of the substantially flat interconnection substrate so as to penetrate through the substantially flat interconnection substrate and be electrically connected to the interconnection pattern. The heat radiation plate is formed of a heat-resistant resin containing carbon fibers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.