Method and apparatus for telemetered probing of integrated circuit operation

US6865503B2 · kind B2 · utility

Assignee

• Conexant Systems, LLC · US

Inventors

• George Harper · Weston, US
• Mark L. Erlenborn · Naperville, US
• Keith A Kind · Mission Viejo, US
• Welborn R Malpass · Evergreen, US
• Sam Spencer · Redmond, US
• Kewei Yang · San Jose, US
• Jeff Gemar · Superior, US

Key dates

• Filing date: Dec 24, 2002
• Grant date: Mar 8, 2005
• Expiry date: Aug 29, 2023

Classification

• Technology area (CPC G): Physics
• CPC primary: G01R31/3025
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

State of test points on an integrated circuit are encapsulated in a telemetry frame that is wirelessly conveyed to a test system. Test points may be logic levels or analog levels converted into representative multi-bit values. Conveyance off the circuit may be by radio frequency or optical emission.