Electrolytic copper-plated R-T-B magnet and plating method thereof
US6866765B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 4, 2001 |
| Grant date | Mar 15, 2005 |
| Priority date | — |
| Expiry date | Feb 3, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12944
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An R-T-B magnet (R is at least one kind of rare-earth elements including Y, and T is Fe or Fe and Co) has an electrolytic copper-plating film where the ratio [I(200)/I(111)] of the X-ray diffraction peak intensity I(200) from the (200) plane to the X-ray diffraction peak intensity I(111) from the (111) plane is 0.1-0.45 in the X-ray diffraction by CuKal rays. This electrolytic copper-plating film is formed by an electrolytic copper-plating method using an electrolytic copper-plating solution which contains 20-150 g/L of copper sulphate and 30-250 g/L of chelating agent and contains no agent for reducing copper ions and has a pH adjusted to 10.5-13.5.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.