Method of purging wafer receiving jig, wafer transfer device, and method of manufacturing semiconductor device
US6867153B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 27, 2004 |
| Grant date | Mar 15, 2005 |
| Priority date | — |
| Expiry date | Jan 27, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A FOUP having semiconductor wafers received therein is transferred to a loading port and then the door of the FOUP is fixed and removed by a FIMS door and then the semiconductor wafers are taken out of the shell of the FOUP and then a predetermined manufacturing processing is performed to the semiconductor wafers. After performing the manufacturing processing, the semiconductor wafers are returned into the shell and the FIMS door is returned to a closed position and the shell is retracted about 50 mm to 65 mm to form a gap between the FIMS door and the shell. Then, purge gas is introduced from a gas introduction pipe arranged above the loading port on the left and right sides in a slanting forward direction of the FIMS door into the shell to replace the atmosphere in the shell with the purge gas.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.