Trecenti Technologies, Inc.
8Patents
0Active
8Granted
27Portfolio score
Filing activity: Feb 25, 2002 → Feb 24, 2005
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6867153B2 | Method of purging wafer receiving jig, wafer transfer device, and method of manufacturing semiconductor device | Electricity | 286 | Expired |
| US7084477B2 | Semiconductor device and manufacturing method of the same | Electricity | 5 | Expired |
| US7009279B2 | Semiconductor device configured for suppressed germanium diffusion from a germanium-doped regions and a method for fabrication thereof | Electricity | 5 | Expired |
| US6738681B2 | Method for manufacturing semiconductor device, semiconductor manufacturing apparatus, and method for controlling transfer in production line | Emerging Cross-Sectional Technologies | 4 | Expired |
| US6830649B2 | Apparatus and method for producing semiconductors | Emerging Cross-Sectional Technologies | 2 | Expired |
| US7234998B2 | Chemical mechanical polishing method, chemical mechanical polishing system, and manufacturing method of semiconductor device | Performing Operations; Transporting | 2 | Expired |
| US6958288B2 | Semiconductor device and manufacturing method thereof | Electricity | 0 | Expired |
| US7026260B2 | Method of manufacturing semiconductor device using thermal treatment that features lower speed wafer rotation at low temperatures and higher speed wafer rotation at high temperatures | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.