Patent · US Expired

Radio-frequency power component, radio-frequency power module, method for producing a radio-frequency power component, and method for producing a radio-frequency power module

US6867492B2 · kind B2 · utility

76Cited by

7References

10Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Albert Auburger · Regenstauf, DE
Frank Klose · Rosenheim, DE
Rudolf Lehner · Papiermühle, DE
Horst Theuss · Wenzenbach, DE

Key dates

Filing date	Jan 17, 2003
Grant date	Mar 15, 2005
Priority date	—
Expiry date	Jan 17, 2023

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3011
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A radio-frequency power component and a radio-frequency power module, as well as to methods for producing them are encompassed. The radio-frequency power component has a semiconductor chip that is suitable for flip chip mounting. The semiconductor chip has an active upper face that produces power losses. This active upper face is covered by an electrically isolating layer leaving free contact surfaces, with a heat-dissipating metal layer being applied to its upper face. The metal layer directly dissipates the heat losses from the active semiconductor structures.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.