Method and application of metrology and process diagnostic information for improved overlay control
US6868301B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 11, 2003 |
| Grant date | Mar 15, 2005 |
| Priority date | — |
| Expiry date | Aug 7, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70633
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method for operation of an exposure tool in the fabrication of an integrated circuit to control registration between a preceding layer of and a succeeding layer. The preceding layer having a first alignment mark and a first registration mark. The succeeding layer is aligned to the preceding layer using an exposure tool. The succeeding layer has a second alignment mark and a second registration mark. The exposure tool measures alignment of the first alignment mark relative to the second alignment mark. After additional process steps are performed, a measurement tool measures registration relating to relative positions of the first registration mark and the second registration mark. Both the alignment information from the exposure tool and the registration information from the measurement tool is analyzed to determine corrections to improve registration between the layers, and the operation of the exposure tool is altered to improve registration.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.