Method of forming bumps
US6869008B2 · kind B2 · utility
9Cited by
20References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 28, 2002 |
| Grant date | Mar 22, 2005 |
| Priority date | — |
| Expiry date | Jun 6, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0557
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
In the conventional bump forming method that can be applied to a semiconductor device in which a large number of bumps are required to be formed, there are various limitations on the material of which the bumps are made, due to enough cubic volume of bumps and to small scattering of the bump height. According to the invention, solder balls and a tool having a large number of through-holes are used, and under the condition that the through-holes of the tool are aligned with the pads of the semiconductor device, the solder balls are charged into the through-holes, pressed to be fixed on the pads, and then reflowed to form bumps.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.