Substrate processing method and substrate processing apparatus
US6869499B2 · kind B2 · utility
6Cited by
26References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 28, 2002 |
| Grant date | Mar 22, 2005 |
| Priority date | — |
| Expiry date | Jul 25, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB08B9/08
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
After semiconductor wafers W have been processed with ozone gas and steam fed into a processing vessel 10, air is fed into the processing vessel 10 from an air supply source connected to an ozone gas supply pipe 42 for feeding ozone gas into the processing vessel 10, whereby an atmosphere of the ozone gas in the processing vessel 10 is replaced with an atmosphere of the air.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.