Chip scale marker and marking method
US6870127B2 · kind B2 · utility
3Cited by
7References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 2, 2003 |
| Grant date | Mar 22, 2005 |
| Priority date | — |
| Expiry date | Oct 7, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/40
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A chip scale marker includes a laser system performing laser marking, a wafer holder on which a wafer subject to the laser marking is mounted, the wafer holder comprising a vacuum plate disposed at a center of the wafer holder for sucking the wafer and a wafer rotating unit provided at a circumference of the vacuum plate and having an open area facing the laser system, a camera disposed above the wafer holder to photograph the wafer, and a warpage removing unit provided above the wafer holder for removing warpage from the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.