Shielded housing for optical semiconductor component
US6870238B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 17, 2002 |
| Grant date | Mar 22, 2005 |
| Priority date | — |
| Expiry date | May 17, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An optical semiconductor package includes an optical semiconductor component (8), a front face of which has an optical sensor (10), and encapsulation defining a cavity in which the optical component is placed and having external electrical connection (11) of this optical semiconductor component (8). The encapsulation (2, 5) includes a glass pane letting light through to the optical sensor. The encapsulation (2, 5) includes electromagnetic screening (23, 24, 28) made of an electrically conductive material, that is externally connectable, this screening being electrically isolated in the optical semiconductor package from the electrical connection of the optical semiconductor component (8).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.