Power delivery through a flex tape in decoupled I/O-power hybrid substrate
US6870257B2 · kind B2 · utility
2Cited by
3References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 4, 2003 |
| Grant date | Mar 22, 2005 |
| Priority date | — |
| Expiry date | Jun 4, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A apparatus is disclosed for use as part of the packaging of an integrated circuit. The apparatus includes one or more flex tapes coupled to the integrated circuit. These flex tapes are utilized to deliver power to the integrated circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.