Jianggi He
6Patents
3h-index
12Co-inventors
43Inventor score
Filing activity: May 28, 2003 → May 25, 2005
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7321167B2 | Flex tape architecture for integrated circuit signal ingress/egress | Electricity | 24 | Expired |
| US7081800B2 | Package integrated one-quarter wavelength and three-quarter wavelength balun | Electricity | 12 | Expired |
| US6877998B1 | Power and ground connectors for socket | Electricity | 6 | Expired |
| US6870257B2 | Power delivery through a flex tape in decoupled I/O-power hybrid substrate | Electricity | 2 | Expired |
| US6903431B2 | Substrate method and apparatus | Electricity | 2 | Expired |
| US7294525B2 | High performance integrated inductor | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.