Discrete circuit component having an up-right circuit die with lateral electrical connections
US6870261B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 26, 2003 |
| Grant date | Mar 22, 2005 |
| Priority date | — |
| Expiry date | Feb 26, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A discrete circuit component having an up-right circuit die with lateral electrical connections. The component comprises a substrate having a pair of electrically conductive traces, and a circuit die is planted between the pair of consecutive traces, wherein one electrode of the circuit die on the surface thereof vertical to the substrate is electrically bonded to one of the conductive trace immediately next thereto, while the other electrode of the circuit die on the opposite surface thereof vertical to the substrate is electrically bonded to the other of the pair of conductive traces immediately next thereto. A body of electrical insulation material hermetically seals the circuit die, and a pair of surface electrodes formed on the surface of the body of insulation material are each electrically connected to the corresponding one of the pair of electrically conductive traces extending from the circuit die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.