Confocal 3D inspection system and process
US6870609B2 · kind B2 · utility
7Cited by
24References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 11, 2002 |
| Grant date | Mar 22, 2005 |
| Priority date | — |
| Expiry date | Mar 21, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01B11/25
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A confocal three dimensional inspection system, and process for use thereof, allows for inspecting of bumps and other three dimensional (3D) features on wafers and other semiconductor substrates. The sensor eliminates out of focus light using a confocal principal to improve depth response.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.