Ultrasonic transducer
US6871770B2 · kind B2 · utility
2Cited by
16References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 18, 2003 |
| Grant date | Mar 29, 2005 |
| Priority date | — |
| Expiry date | May 28, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01082
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A transducer for a wire bonding apparatus is formed of two separate parts sandwiching therebetween a plurality of piezoelectric elements. One of the two parts is the amplifying horn, and by selecting appropriate sizes and shapes for the two parts, vibrational energy can be concentrated at the distal end of the amplifying horn where the bonding tool is located.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.