Atomic layer deposition method
US6872421B2 · kind B2 · utility
17Cited by
17References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 19, 2003 |
| Grant date | Mar 29, 2005 |
| Priority date | — |
| Expiry date | Aug 19, 2023 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/45589
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An apparatus and method for performing atomic layer deposition. A plurality of substrates are loaded into a plurality of reaction cells. The reaction cells are disposed in a reaction chamber isolated from an exterior condition. Various paper substances are ultimately and repeatedly applied onto each substrate such that a thin film is formed on each substrate. The plurality of vapor injection pipes each inject one of the vapor substances by periodically scanning over each substrate to apply substance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.