Solder
US6872465B2 · kind B2 · utility
26Cited by
9References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 7, 2003 |
| Grant date | Mar 29, 2005 |
| Priority date | — |
| Expiry date | Mar 7, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/1291
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a solder that realizes high-temperature-side solder bonding in temperature-hierarchical bonding, a connection portion between a semiconductor device and a substrate is formed of metal balls made of Cu or the like and compounds formed of metal balls and Sn, and the metal balls are bonded together by the compounds.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.