METHOD FOR MANUFACTURING MASTER SUBSTRATE USED FOR MANUFACTURING GROOVED MOLDING SUBSTRATE, METHOD FOR MANUFACTURING STAMPER FOR MANUFACTURING GROOVED MOLDING SUBSTRATE, METHOD FOR MANUFACTURING GROOVED MOLDING SUBSTRATE, GROOVED MOLDING SUBSTRATE, MEMORY MEDIUM, MEMORY DEVICE, AND COMPUTER
US6874262B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 4, 2003 |
| Grant date | Apr 5, 2005 |
| Priority date | — |
| Expiry date | Apr 4, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B7/263
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A substrate having a photoresist coated thereon is exposed to exposure light along a line through a lens 1. The exposure position is moved from the initial position O1 to a position O2 that is separated from the initial position by a distance corresponding to the sum of a groove width Gw and a land width Lw. The exposure is carried out along a line parallel to the initial exposure line. By repeating this, exposed areas having a width Lw and a separation Gw are formed on the photoresist. The photoresist is developed to remove the exposed areas of the photoresist. A resin or the like is pressed on it to form a replica. From the replica, a stamper is manufactured using an electroforming method. Finally, a grooved molding substrate is manufactured from a glass or resin using the stamper. Although the land width Lw is defined by the effective spot diameter φ of the optical system, the groove width Gw can be less than this value.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.