Wafer applied thermally conductive interposer
US6875636B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 14, 2003 |
| Grant date | Apr 5, 2005 |
| Priority date | — |
| Expiry date | Jul 14, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thermally conductive film is attached to an integrated circuit (IC) wafer through a number of steps. Initially, a thermally conductive film is positioned on a first side of a block. Next, an IC wafer that includes a plurality of chips is positioned with its non-active side in contact with the film. Then, a first surface of an elastomer pad is positioned in contact with an active side of the wafer. Next, a predetermined pressure is applied between a second side of the block that is opposite the first side and a second surface of the elastomer pad that is opposite the first surface. Finally, the film, the block, the wafer and the elastomer pad are heated to a predetermined temperature for a predetermined time while a predetermined pressure is applied to bond the film to the wafer without bonding the film to the block.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.