David A. Laudick
8Patents
5h-index
8Co-inventors
48Inventor score
Filing activity: Jul 14, 2003 → Oct 26, 2007
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7739791B2 | Method of producing an overmolded electronic module with a flexible circuit pigtail | Emerging Cross-Sectional Technologies | 49 | Active |
| US7510108B2 | Method of making an electronic assembly | Electricity | 12 | Active |
| US7473585B2 | Technique for manufacturing an overmolded electronic assembly | Electricity | 11 | Expired |
| US7230829B2 | Overmolded electronic assembly with insert molded heat sinks | Emerging Cross-Sectional Technologies | 11 | Expired |
| US6905349B1 | Technique for connector to printed circuit board decoupling to eliminate flexure | Electricity | 9 | Expired |
| US7268429B2 | Technique for manufacturing an overmolded electronic assembly | Electricity | 2 | Expired |
| US7603770B2 | Method of overmolding an electronic assembly having an insert-molded vertical mount connector header | Emerging Cross-Sectional Technologies | 2 | Active |
| US6875636B2 | Wafer applied thermally conductive interposer | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.