Manufacturing method of a semiconductor device incorporating a passive element and a redistribution board
US6875638B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 19, 2002 |
| Grant date | Apr 5, 2005 |
| Priority date | — |
| Expiry date | Mar 19, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10977
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A manufacturing method of a semiconductor device incorporating a passive element includes the steps as follows: a redistribution board forming step forms a redistribution board incorporating the passive element on a base board; a semiconductor element mounting step mounts at least one semiconductor element formed on an opposite side surface of the redistribution board with regard to the base board; a base board separating step separates the base board from the redistribution board and exposes the other surface of the redistribution board; a redistribution board mounting step mounts the redistribution board on a package board via electrode pads exposed from the other surface of the redistribution board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.