Micromechanical component as well as a method for producing a micromechanical component

US6876048B2 · kind B2 · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Frank Fischer · Mesa, US
• Peter Hein · Bamberg, DE
• Eckhard Graf · Gomaringen, DE

Key dates

• Filing date: Feb 4, 2002
• Grant date: Apr 5, 2005
• Expiry date: Nov 3, 2022

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B81C2203/019
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

A micromechanical component having a substrate beneath at least one structured layer, in the structured layer at least one functional structure being formed, a cap which covers the functional structure, between the cap and the functional structure at least one cavity being formed, and a connecting layer which connects the cap to structured layer, as well as a method for producing the micromechanical component. To obtain a compact and robust component, the connecting layer is formed from an anodically bondable glass, i.e. a bond glass, which has a thickness in the range of 300 nm to 100 μm, which may in particular be in the range of 300 nm to 50 μm.