Eckhard Graf
21Patents
8h-index
31Co-inventors
75Inventor score
Filing activity: Nov 17, 1994 → Dec 17, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6406979B2 | Method for sectioning a substrate wafer into a plurality of substrate chips | Electricity | 53 | Expired |
| US5937275A | Method of producing acceleration sensors | Physics | 48 | Expired |
| US6951824B2 | Method for manufacturing a micromechanical component and a component that is manufactured in accordance with the method | Physics | 37 | Expired |
| US6140709A | Bonding pad structure and method for manufacturing the bonding pad structure | Electricity | 23 | Expired |
| US5465758A | Apparatus for sealing leakage points in pipes from the inside of the pipe, and a method of sealing the leakage points | Mechanical Engineering; Lighting; Heating | 17 | Expired |
| US6465854B1 | Micromechanical component | Performing Operations; Transporting | 15 | Expired |
| US6876048B2 | Micromechanical component as well as a method for producing a micromechanical component | Performing Operations; Transporting | 10 | Expired |
| US5769459A | Inside sealing device sleeve for insertion of pipes | Mechanical Engineering; Lighting; Heating | 10 | Expired |
| US7153718B2 | Micromechanical component as well as a method for producing a micromechanical component | Performing Operations; Transporting | 7 | Expired |
| US6955975B2 | Method for joining a silicon plate to a second plate | Electricity | 5 | Expired |
| US8748998B2 | Sensor module | Performing Operations; Transporting | 5 | Active |
| US8174082B2 | Micromechanical component having multiple caverns, and manufacturing method | Performing Operations; Transporting | 1 | Active |
| US8587095B2 | Method for establishing and closing a trench of a semiconductor component | Electricity | 0 | Active |
| US8975118B2 | Component having a via and method for manufacturing it | Electricity | 0 | Active |
| US8138006B2 | Method for producing a micromechanical component having a trench structure for backside contact | Electricity | 0 | Active |
| US11261082B2 | Micromechanical device and method for manufacturing a micromechanical device | Performing Operations; Transporting | 0 | Active |
| US8419957B2 | Method for producing a micromechanical component having a filler layer and a masking layer | Performing Operations; Transporting | 0 | Active |
| US10752498B2 | MEMS component having two different internal pressures | Performing Operations; Transporting | 0 | Active |
| US8647961B2 | Method for filling cavities in wafers, correspondingly filled blind hole and wafer having correspondingly filled insulation trenches | Electricity | 0 | Active |
| US8564078B2 | Method for producing a micromechanical component having a trench structure for backside contact | Electricity | 0 | Active |
| US7294894B2 | Micromechanical cap structure and a corresponding production method | Performing Operations; Transporting | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.