Semiconductor device having superior resistance to moisture
US6876064B2 · kind B2 · utility
18Cited by
4References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 9, 2004 |
| Grant date | Apr 5, 2005 |
| Priority date | — |
| Expiry date | Jan 9, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a semiconductor device, a circuit unit is formed in an inside portion, and seal rings that enclose the inside portion that are composed of walls of metal layers are formed around the periphery. In the corners, the seal rings include linear parts that extend inwardly in addition to the linear parts that extend along the periphery, whereby the seal rings are formed in a planar pattern having small rectangular planar patterns in each corner.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.