Capacitive finger coupling element on a silicon support for coupling a strip line structure
US6876268B2 · kind B2 · utility
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2References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 7, 2002 |
| Grant date | Apr 5, 2005 |
| Priority date | — |
| Expiry date | May 7, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01P1/203
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A coupling element for an HF strip line structure on an HF substrate, implemented in thin-layer technology as a finger coupler structure on a silicon support is described. The bonding to the strip line tracks of the HF strip line structure is effected via metallizations, in particular in the form of spacers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.