Method for sealing an active area of a surface acoustic wave device on a wafer
US6877209B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 28, 2002 |
| Grant date | Apr 12, 2005 |
| Priority date | — |
| Expiry date | Nov 3, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12521
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
One embodiment disclosed relates to a method for sealing an active area of a surface acoustic wave (SAW) device on a wafer. The method includes providing a sacrificial material over at least the active area of the SAW device, depositing a seal coating over the wafer so that the seal coating covers the sacrificial material, and replacing the sacrificial material with a target atmosphere. Another embodiment disclosed relates to an SAW device sealed at the wafer level (i.e. prior to separation of the die from the wafer). The device includes an active area to be protected, an electrical contact area, and a lithographically-formed structure sealing at least the active area and leaving at least a portion of the electrical contact area exposed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.