Mike Bruner
9Patents
5h-index
11Co-inventors
49Inventor score
Filing activity: Sep 13, 2001 → May 13, 2005
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7049164B2 | Microelectronic mechanical system and methods | Performing Operations; Transporting | 68 | Expired |
| US6930364B2 | Microelectronic mechanical system and methods | Performing Operations; Transporting | 19 | Expired |
| US6991953B1 | Microelectronic mechanical system and methods | Performing Operations; Transporting | 16 | Expired |
| US6877209B1 | Method for sealing an active area of a surface acoustic wave device on a wafer | Emerging Cross-Sectional Technologies | 13 | Expired |
| US7183637B2 | Microelectronic mechanical system and methods | Performing Operations; Transporting | 11 | Expired |
| US7466022B2 | Wafer-level seal for non-silicon-based devices | Emerging Cross-Sectional Technologies | 5 | Active |
| US6835616B1 | Method of forming a floating metal structure in an integrated circuit | Emerging Cross-Sectional Technologies | 4 | Expired |
| US6846423B1 | Wafer-level seal for non-silicon-based devices | Emerging Cross-Sectional Technologies | 3 | Expired |
| US7227212B1 | Method of forming a floating metal structure in an integrated circuit | Emerging Cross-Sectional Technologies | 1 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.