Polishing pad window for a chemical-mechanical polishing tool
US6878039B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 28, 2002 |
| Grant date | Apr 12, 2005 |
| Priority date | — |
| Expiry date | Apr 19, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/26
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing pad assembly for use in a chemical-mechanical polishing apparatus comprises a polishing pad having at least a first aperture therethrough and a platen for supporting the polishing pad having a second aperture therethrough at least a portion of which is larger than the first aperture. A substantially transparent plug includes at least a first section having a first dimension for positioning substantially within the first aperture and at least a second section having a second dimension larger than the first dimension for positioning substantially within the second aperture. The optical plug is made of a polymeric material which may be press-fit through the platen into polishing pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.