Lid assembly for a processing system to facilitate sequential deposition techniques
US6878206B2 · kind B2 · utility
675Cited by
243References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 12, 2001 |
| Grant date | Apr 12, 2005 |
| Priority date | — |
| Expiry date | May 6, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67017
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A lid assembly for a semiconductor processing system is provided. The lid assembly generally includes a lid having a gas manifold mounted on a first side and a baffle plate mounted on a second side. The gas manifold is configured to deliver a plurality of gases to a plenum defined between the baffle plate and the lid. The gases are mixed within a recess formed in the baffle plate before exiting into the processing system through a singular passage.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.