Patent · US Expired

Method of reinforcing a mechanical microstructure

US6878566B2 · kind B2 · utility

1Cited by
3References
15Claims
0Family size

Assignee

Inventor

Key dates

Filing dateDec 27, 2002
Grant dateApr 12, 2005
Priority date
Expiry dateDec 27, 2022

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG01P2015/0814
  • WIPO fieldMicro-structural and nano-technology
  • WIPO sectorChemistry

Abstract

A mechanical microstructure including a deformable first layer overhanging a second layer and defining a cavity set back from an external face of the deformable first layer and having an abutment stud projecting into the cavity, in which a wire is connected to a portion of an internal face of the deformable first layer. The portion of the first layer is opposite a bottom area of the cavity into which the abutment stud projects, but the abutment stud remains at a distance from the deformable first layer. A method of producing the mechanical microstructure is also disclosed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.