Method of reinforcing a mechanical microstructure
US6878566B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 27, 2002 |
| Grant date | Apr 12, 2005 |
| Priority date | — |
| Expiry date | Dec 27, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01P2015/0814
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A mechanical microstructure including a deformable first layer overhanging a second layer and defining a cavity set back from an external face of the deformable first layer and having an abutment stud projecting into the cavity, in which a wire is connected to a portion of an internal face of the deformable first layer. The portion of the first layer is opposite a bottom area of the cavity into which the abutment stud projects, but the abutment stud remains at a distance from the deformable first layer. A method of producing the mechanical microstructure is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.