Method and apparatus for fabrication of passivated microfluidic structures in semiconductor substrates
US6878567B2 · kind B2 · utility
6Cited by
9References
23Claims
0Family size
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Key dates
| Filing date | Jun 29, 2001 |
| Grant date | Apr 12, 2005 |
| Priority date | — |
| Expiry date | Jun 29, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/958
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method and apparatus for fabrication of passivated microfluidic structures is disclosed. The method includes providing a substrate having a microfluidic structure formed therein. The microfluidic structure is embedded by an embedding layer. The method further includes passivating the embedded microfluidic structure by locally heating the microfluidic structure surface in a reactive atmosphere, wherein the passivated microfluidic structure is suitable for transporting a fluid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.