Method for detecting CMP endpoint in acidic slurries
US6878629B1 · kind B1 · utility
2Cited by
6References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 27, 2002 |
| Grant date | Apr 12, 2005 |
| Priority date | — |
| Expiry date | Aug 14, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/31053
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus for measuring ammonia gas concentration in an ongoing mechanical polishing (CMP) cycle utilizing an acidic CMP slurry, having the following components:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.