Disturbance-free, recipe-controlled plasma processing method
US6881352B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 24, 2003 |
| Grant date | Apr 19, 2005 |
| Priority date | — |
| Expiry date | Jan 24, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P90/02
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A plasma processing control system and method which can suppress influences caused by disturbances. The control system includes a plasma processor for performing processing operation over a sample accommodated within a vacuum processing chamber, a sensor for monitoring process parameters during processing operation of the plasma processor, a processed-result estimation model for estimating a processed result on the basis of a monitored output of the sensor and a preset processed-result prediction equation, and an optimum recipe calculation model for calculating correction values of processing conditions on the basis of an estimated result of the processed-result estimation model in such a manner that the processed result becomes a target value. The plasma processor is controlled on the basis of a recipe generated by the optimum recipe calculation model.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.