Confocal 3D inspection system and process
US6882415B1 · kind B1 · utility
5Cited by
28References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 16, 2002 |
| Grant date | Apr 19, 2005 |
| Priority date | — |
| Expiry date | Jul 16, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B21/22
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A confocal three dimensional inspection system, and process for use thereof, allows for rapid inspecting of bumps and other three dimensional (3D) features on wafers, other semiconductor substrates and other large format micro topographies. The sensor eliminates out of focus light using a confocal principal to create a narrow depth response in the micron range.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.