Semiconductor manufacturing facility and a semiconductor manufacturing method
US6883283B2 · kind B2 · utility
0Cited by
8References
6Claims
0Family size
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Key dates
| Filing date | Mar 22, 2002 |
| Grant date | Apr 26, 2005 |
| Priority date | — |
| Expiry date | Jun 25, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/709
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A semiconductor manufacturing facility has a proper strength and an anti-vibration effect. The semiconductor facility contains processing apparatuses, installation tables and an installation floor. An apparatus having a vibration source is installed on an installation table having a rigid structure. The installation table is installed on the installation floor having a floor construction including a plurality of columns, which support a floor member extending in horizontal directions. An interval of the columns is 4 m to 12 m.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.