Polishing pad sensor assembly with a damping pad
US6884150B2 · kind B2 · utility
5Cited by
17References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 8, 2002 |
| Grant date | Apr 26, 2005 |
| Priority date | — |
| Expiry date | Dec 20, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/12
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing pad having an optical assembly that does not cause excess wear on a wafer workpiece. The optical assembly is disposed within the pad such that it may move in response to forces applied to the optical assembly. A damping pad may be disposed on the optical assembly to reduce vibrations and further increase the sensitivity of optical measurements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.