Method for apparatus for polishing outer peripheral chamfered part of wafer
US6884154B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 21, 2001 |
| Grant date | Apr 26, 2005 |
| Priority date | — |
| Expiry date | May 23, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D9/04
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
In a process for polishing the chamfered peripheral part of a wafer using a polishing cloth while supplying a polishing slurry in order to improve productivity of the process by reducing a polishing time, at least two steps of polishing processes are performed in sequence. The process comprises a first polishing process to polish a particular part, e.g. the part corresponding to the {110} plane of a peripheral part of the wafer and a second polishing process in which the whole part of a peripheral part of the wafer is polished for finishing by means of varying a hardness of the polishing clothes and/or a particle size of abrasives in the slurry such as the hardness of the polishing cloth in the second polishing process being softer than that of in the first polishing process and a particle size of abrasives in the slurry in the second polishing process being finer than that of in the first polishing process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.