Multi-layer polishing pad material for CMP
US6884156B2 · kind B2 · utility
38Cited by
16References
38Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 17, 2003 |
| Grant date | Apr 26, 2005 |
| Priority date | — |
| Expiry date | Jun 17, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D3/32
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The invention is directed to a multi-layer polishing pad for chemical-mechanical polishing comprising a polishing layer and a bottom layer, wherein the polishing layer and bottom layer are joined together without the use of an adhesive. The invention is also directed to a polishing pad comprising an optically transmissive multi-layer polishing pad material, wherein the layers of the polishing pad material are joined together without the use of an adhesive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.